Quantum Packaging Lead

Minimum qualifications

• Bachelor's degree in Engineering, Science, or equivalent practical experience.

• 5 years of experience in Micro Electro Mechanical Systems (MEMS)/semiconductors advanced packaging including design, development, and testing.

• 3 years of experience in people management.

• Experience in package techniques including 3D integration, wire bonding, bump bonding, land grid array, through-silicon vias, spring contacts, micromachining, and related characterization of reliability and yield.

Preferred qualifications

• Experience leading high-precision research and development packaging development team and projects.

• Experience with cryogenic vacuum environments, thermal cycling, and related challenges.

• Experience building and managing vendor supply chains.

• Experience with microwave devices such as transmission lines, waveguides, resonators, or antennas.

• Experience with superconducting circuits and/or quantum computing hardware such as superconducting qubits, spin qubits, or trapped ions.

The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.

Google Research is building the next generation of intelligent systems for all Google products. To achieve this, we're working on projects that utilize the latest computer science techniques developed by skilled software developers and research scientists. Google Research teams collaborate closely with other teams across Google, maintaining the flexibility and versatility required to adapt new projects and foci that meet the demands of the world's fast-paced business needs.

The US base salary range for this full-time position is $168,000-$252,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

• Lead team of engineers and technicians. Manage team projects for impacts to schedule, performance and yield by conducting risk analysis and developing mitigation strategies to ensure on-time delivery.

• Drive the technical direction of projects to develop and implement solutions to challenging problems. Develop project timelines, identifying key decision/completion dates.

• Develop and qualify superconducting packaging processes used in cryogenic environment by leading the development life cycle, including design, procurement of materials and components, characterization, testing, and validation.

• Leverage 3D integration technologies to enable high density signal delivery from wiring to quantum processors that meet mechanical, thermal, and signal integrity requirements.

• Collaborate with other teams to identify performance improvements and resolve manufacturing and yield issues.

Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also ~~~/ and ~~~ If you have a need that requires accommodation, please let us know by completing our Accommodations for Applicants form: ~~~.